|
型 号
|
厂 家
|
封 装
|
批 号
|
|
HC2G826M25020
|
SAMW
|
11+
|
DIP2
|
|
HC2G826M22025
|
SAMW
|
11+
|
DIP2
|
|
HC2G827M40060
|
SAMW
|
11+
|
DIP2
|
|
T330A106K010AS
|
KEMET
|
11+
|
DIP
|
|
CL321611T-R56M-N
|
|
11+
|
SMD
|
|
CL321611T-R68M-N
|
|
11+
|
SMD
|
|
CL321611T-R47M-N
|
|
11+
|
SMD
|
|
CL32A226MOJNNNF
|
SAMSUNG
|
11+
|
SMD
|
|
CL321611T-R82M-N
|
|
11+
|
SMD
|
|
CL321611T-R39M-N
|
|
11+
|
SMD
|
|
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