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| 3362P-1-501LF资料 | |
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3362P-1-501LF PDF Download |
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File Size : 116 KB
Manufacturer:BOURNS Description:A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135) diameter drill and have a final plated thru diameter of .25 mm (.010). Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. RF trace width depends upon the PC board material and construction. Use 1 oz. Copper minimum. All dimensions are in millimeters (inches). Angles are in degree |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：3362P-1-501LF 厂 家：BOURNS 封 装：09+ 批 号：3362P 数 量：15000 说 明：深圳市荣发电子，专营贴片电容，电感，磁珠，蜂鸣器，咪头，保险丝，连接器,继电器，二三极管，LED,晶振，真诚为广大客户提供配套服务 |
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| 联系人：林小姐 |
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| 公司地址： 深圳市福田区华强北佳和大厦4C143 |
