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3362S-1-103LF资料 | |
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3362S-1-103LF PDF Download |
File Size : 116 KB
Manufacturer:BOURNS Description:For both packages, the RÈJAvalues were computed using JEDEC high K board (2S2P) with 1 ounce internal copper plane and ground plane. There was no air flow across the packages. RÈJA was computed assuming a vertical, free standing TO-220 package with pins soldered to the board. There is no heatsink attached to the package. RÈJA was computed assuming a horizontally mounted TO-263 package with pins soldered to the board. There is no copper pad underneath the package. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:3362S-1-103LF 厂 家:BOURNS 封 装:09+ 批 号:3362S 数 量:15000 说 明:深圳市荣发电子,专营贴片电容,电感,磁珠,蜂鸣器,咪头,保险丝,连接器,继电器,二三极管,LED,晶振,真诚为广大客户提供配套服务 |
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