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| 3386F-1-503LF资料 | |
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3386F-1-503LF PDF Download |
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File Size : 116 KB
Manufacturer:BOURNS Description: The A2557xB, A2557xEB, and A2557xLB have been specifically designed to provide cost-effective solutions to relay-driving applications with up to 300 mA drive current per channel. They may also be used for driving incandescent lamps in applications where turn-on time is not a concern. Each of the four outputs will sink 300 mA in the on state. The outputs have a minimum breakdown voltage of 60 V and a sustaining voltage of 40 V. A low-power Sleep Mode is activated with either ENABLE low or all inputs low. In this mode, the supply current drops to below 100 µA. Over-current protection for each channel has been designed into these devices and is activated at a nominal 500 mA. It protects each output from short circuits with supply voltages up to 32 V. When an output experiences a short circuit, the output current is limited at the 500 mA current clamp. In addition, foldback circuitry decreases the current limit if an excessive voltage is present across the output and assists in keeping the device within its SOA (safe operating area). An exclusive-OR circuit compares the input and output state of each driver. If either a short or open load condition is detected, a single FAULT output is turned on (active low). Similar devices, for operation to 1.3 A, are available as the UDx2547B/EB. Continuous or multiple overload conditions causing the channel tempera- ture to reach approximately 165C will result in an additional linear decrease in the output current of the affected driver. If the fault condition is corrected, the output stage will return to its normal saturated condition. The first character of the part number suffix determines the device operating temperature range. Suffix S- is the standard -20C to +85C; suffix E- is -40C to +85C; suffix K- is for the industrial temperature range of -40C to +125C. Package suffix -B devices are 16-pin power DIPs; suffix -EB devices are 28-lead power PLCCs; and suffix -LB are 16- lead power wide-body SOICs for surface-mount applications. All packages are of batwing construction to provide for maximum package power dissipa- tion. |
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| 1PCS | 100PCS | 1K | 10K | ||
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型 号：3386F-1-503LF 厂 家：BOURNS 封 装：09+ 批 号：3386F 数 量： 说 明：10000 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：0755-83041767,82716726 |
| 手 机：13570833454 |
| QQ：133289964,506456591,1062431938 |
| MSN：RFDZ0754@126.COM |
| 传 真：0755-82716726 |
| EMail：rxdz0754HK@126.com |
| 公司地址： 深圳市福田区华强北佳和大厦4C143 |
