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BUT11AI

BUT11AI资料
BUT11AI
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Description:Note 2: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a heatsink is used). The junction-to-ambient thermal resistance ( J-A) for the TO-252 is approximately 90˚C/W for a PC board mounting with the device soldered down to minimum copper area (less than 0.1 square inch). If one square inch of copper is used as a heat dissipator for the TO-252, the J-A drops to approximately 50˚C/W. The SOT-223 package has a J-A of approximately 125˚C/W when soldered down to a minimum sized pattern (less than 0.1 square inch) and approximately 70˚C/W when soldered to a copper area of one square inch. The J-A values for the LLP package are also dependent on trace area, copper thickness, and the number of thermal vias used (refer to application note AN-1187). If power disspation causes the junction temperature to exceed specified limits, the device will go into thermal shutdown.
 
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型 号：BUT11AI
厂 家：
封 装：
批 号：1108
数 量：原装现货，欢迎来电垂询
说 明：TO220
 
 
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