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BZX84B6V8LT1G资料 | |
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BZX84B6V8LT1G PDF Download |
File Size : 116 KB
Manufacturer:ON Description:Package thermal resistance is 40 C/W under the EIA/JESD51-3 compliant PCB test board condition. Users should ensure that the junction temperature does not exceed 150C. Thermal resistance from junction to case and to ambient is very much dependent on how the IC is mounted onto the board, on the PCB layout and on any heat extraction arrangements. Power consumption and system ambient operating temperature limits should be noted and careful thermal gradient calculations undertaken to ensure that the junction temperature never exceeds 150C. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:BZX84B6V8LT1G 厂 家:ON 封 装:2009 批 号:65000 数 量:SOT-23 说 明: |
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