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| DSS6NF31C223Q55B资料 | |
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DSS6NF31C223Q55B PDF Download |
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File Size : 116 KB
Manufacturer:MURATA Description:Layout Considerations A sufficient number of holes (QTY 12 - 0.2mm diameter plated through hole) should be placed under the module in order to channel the heat properly. In addition, contact should be made between the PA slug located under the amplifier and the board. For hand assembly of the board, place sufficient bonding paste so that contact is made between the PA and ground. For large volume assembly, please refer to the solder profile recommendations application note. For RF in and out provide 50 Ω transmission lines. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：DSS6NF31C223Q55B 厂 家：MURATA 封 装：08＋ 批 号：2000 数 量： 说 明：原装现货 |
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