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| KL731ETP10NHG资料 | |
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KL731ETP10NHG PDF Download |
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File Size : 116 KB
Manufacturer: Description:The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread. The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：KL731ETP10NHG 厂 家： 封 装：08＋ 批 号：45200 数 量： 说 明：原装现货 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：0755-83041767,82716726 |
| 手 机：13570833454 |
| QQ：133289964,506456591,1062431938 |
| MSN：RFDZ0754@126.COM |
| 传 真：0755-82716726 |
| EMail：rxdz0754HK@126.com |
| 公司地址： 深圳市福田区华强北佳和大厦4C143 |
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