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| KQ0805TE22NHK资料 | |
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KQ0805TE22NHK PDF Download |
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File Size : 116 KB
Manufacturer: Description:Note 10: The given JA is for an HWD2119 package in an LDA08B with the Exposed-DAP soldered to a printed circuit board copper pad with an area equivalent to that of the Exposed-DAP itself. The Exposed-DAP of the LDA08B package should be electrically connected to GND or an electrically isolated copper area. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：KQ0805TE22NHK 厂 家： 封 装：08＋ 批 号：14300 数 量： 说 明：原装现货 |
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