|
|||||||
|
|||||||
|
|
|
|||||||
|
|||||||
|
|
| LQW18AN82NG00D资料 | |
|
LQW18AN82NG00D PDF Download |
|
File Size : 116 KB
Manufacturer: Description:0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO BOTTOM, AND INTERNAL GROUIND PLANES IN ORDE MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MA VIA BARREL PLATTING TO BE MIN. 0.0014 THICK. VIA PLUGGED WITH EITHER CONDUCTIVE OR NON-COND EPOXY TO PREVENT SOLDER. DRAINS THROUGH VI REFLOW PROCESS |
|
| 相关型号 | |
| ◆ STM32H745ZIT6 | |
| ◆ FT838NB1-RT | |
| ◆ AO4485 | |
| ◆ RFANT5220110A0T | |
| ◆ RFANT3216120A5T | |
| ◆ P13-I39606 | |
| ◆ DF30FC-40DS-0.4V(82) | |
| ◆ JS202011SCQN | |
| ◆ 2041119-1 | |
| ◆ 541044031 | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
|
型 号：LQW18AN82NG00D 厂 家： 封 装：08＋ 批 号：88000 数 量： 说 明：原装现货 |
|||||
|
运 费： 所在地： 新旧程度： |
|||||
| 联系人：林小姐 |
| 电 话：0755-83041767,82716726 |
| 手 机：13570833454 |
| QQ：133289964,506456591,1062431938 |
| MSN：RFDZ0754@126.COM |
| 传 真：0755-82716726 |
| EMail：rxdz0754HK@126.com |
| 公司地址： 深圳市福田区华强北佳和大厦4C143 |
