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| LT1129IS8资料 | |
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LT1129IS8 PDF Download |
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File Size : 116 KB
Manufacturer: Description:These devices do not normally require heat sinks, however, standard precautionary design and layout procedures should be used to ensure devices do not overheat. The ground and power planes beneath the package, as well as all pcb signal runs to and from the device, should be as heavy as possible to help conduct heat away from the package. |
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| ◆ JS202011SCQN | |
| ◆ 2041119-1 | |
| ◆ 541044031 | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：LT1129IS8 厂 家： 封 装： 批 号： 数 量： 说 明： LT1129IS8#PBF SOP08全新进口原装 |
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