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MM3Z10VST1G

MM3Z10VST1G资料
MM3Z10VST1G
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File Size : 116 KB
Manufacturer:ON
Description:Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
 
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  1PCS 100PCS 1K 10K  
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型 号:MM3Z10VST1G
厂 家:ON
封 装:2009
批 号:65000
数 量:SOD-323
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