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| MM3Z6V8T1资料 | |
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MM3Z6V8T1 PDF Download |
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File Size : 116 KB
Manufacturer:ON Description:The total thermal resistance from junction to ambient can be as low as 45C/W. This requires a reasonable sized PC board with at least on layer of copper to spread the heat across the board and couple it into the surrounding air. Experiments have shown that the heat spreading copper layer does not need to be electrically connected to the tab of the device. The PC material can be very effective at transmitting heat between the pad area, attached to the pad of the device, and a ground plane layer either inside or on the opposite side of the board. Although the actual thermal resistance of the PC material is high, the Length/Area ratio of the thermal resistance between layers is small. The data in Table 1, was taken using 1/16 FR-4 board with 1 oz. copper foil, and it can be used as a rough guideline for estimating thermal resistance. For each application the thermal resistance will be affected by thermal interactions with other components on the board. To determine the actual value some experimentation will be necessary. The power dissipation of the AMS2907 is equal to: |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MM3Z6V8T1 厂 家：ON 封 装：2009 批 号：65000 数 量：SOD-323 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：0755-83041767,82716726 |
| 手 机：13570833454 |
| QQ：133289964,506456591,1062431938 |
| MSN：RFDZ0754@126.COM |
| 传 真：0755-82716726 |
| EMail：rxdz0754HK@126.com |
| 公司地址： 深圳市福田区华强北佳和大厦4C143 |
技术支持:维库电子市场网