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| MMBZ5268BLT1G资料 | |
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MMBZ5268BLT1G PDF Download |
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File Size : 116 KB
Manufacturer:ON Description:The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior me- chanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of sur- face roughness and improve thermal spread. The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads. |
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| ◆ 2041119-1 | |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MMBZ5268BLT1G 厂 家：ON 封 装：2009 批 号：65000 数 量：SOT-23 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：0755-83041767,82716726 |
| 手 机：13570833454 |
| QQ：133289964,506456591,1062431938 |
| MSN：RFDZ0754@126.COM |
| 传 真：0755-82716726 |
| EMail：rxdz0754HK@126.com |
| 公司地址： 深圳市福田区华强北佳和大厦4C143 |
