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| MMBZ6V2ALT3G资料 | |
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MMBZ6V2ALT3G PDF Download |
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File Size : 116 KB
Manufacturer:ON Description:PGND (Bump D3): Power ground pin. Connect directly to the ground plane. AGND (Bump C3): Analog ground pin. Connect the analog ground pin directly to the PGND pin. VIN (Bump B3): Supply or input voltage connection pin. The CIN capacitor should be as close to the device as possible, between the VIN pin and ground plane. En2 (Bump A3): Enable pin for the internal NMOS FET switch (Figure 2: N2) during device operation. When VEn2 is |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MMBZ6V2ALT3G 厂 家：ON 封 装：2009 批 号：65000 数 量：SOT-23 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：0755-83041767,82716726 |
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| 公司地址： 深圳市福田区华强北佳和大厦4C143 |
