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| MZA3216Y121BT000资料 | |
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MZA3216Y121BT000 PDF Download |
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File Size : 116 KB
Manufacturer: Description:Thermocompression bonding is recommended. Welding or conductive epoxy may also be used. For additional information see Application Note 979, The Handling and Bonding of Beam Lead Devices Made Easy, or Application Note 992, Beam Lead Attachment Methods, or |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MZA3216Y121BT000 厂 家： 封 装：08＋ 批 号：116000 数 量： 说 明：原装现货 |
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