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TC7WH14FU资料 | |
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TC7WH14FU PDF Download |
File Size : 116 KB
Manufacturer: Description:Notes: 1. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charge Device Model) 2. Junction to ambient thermal resistance, ÈJC, is a strong function of PCB material, board thickness, thickness and number of copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:TC7WH14FU 厂 家: 封 装:SMD 批 号:09+ 数 量:12000 说 明:原装现货 |
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运 费: 所在地: 新旧程度: |
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